communications BNC Materials
Configurable Three-Dimensional Boron Nitride–Carbon Architecture and Its Tunable Electronic Behavior with Stable Thermal Performances Manuela Loeblein, Roland Yingjie Tay, Siu Hon Tsang, Wei Beng Ng, and Edwin Hang Tong Teo* Recently synthesized three-dimensional (3D) foam-like materials have been reported as a new way of building up normally 2D flat materials into 3D space.[1,2] These 3D porous materials retain many of the unique properties of its constituent 2D material while creating a bulk, low density, flexible and ultralight version of its “bulk” form. For example, 3D-graphene (3D-C), has combined the advantages of high specific surface area, strong mechanical strength with excellent transport kinetic (both thermal[3,4] and electrical[1] and has widen its application horizon into stretchable electronics,[1,5] energy storage,[6] chemical and mechanical sensing[7] and electromagnetic interference (EMI) shielding.[8] Not long ago, h-BN, the isoelectric analogs to graphene with similar structural properties except for its electrical insulation with high dielectric constant,[9] has also evolved into the 3D form and found its niche in ultralow permittivity applications. This ceramic bulk foams are also found to have high specific strength, low dielectric constants and loss tangents, and good thermal conductivity for high temperature application and thermal insulation.[2,10] More importantly, the crystalline structure of these two 3D materials (3D-C and 3D h-BN) closely matches with one another, leading to remarkably similar material properties (very high thermal conductivity, high temperature stability, excellent mechanical properties) and also contrasting (electrical conductivity, permittivity) at the same time.[11–13] Furthermore, due to the close lattice matching (
Configurable Three-Dimensional Boron Nitride–Carbon Architecture and Its Tunable Electronic Behavior with Stable Thermal Performances Manuela Loeblein, Roland Yingjie Tay, Siu Hon Tsang, Wei Beng Ng, and Edwin Hang Tong Teo* Recently synthesized three-dimensional (3D) foam-like materials have been reported as a new way of building up normally 2D flat materials into 3D space.[1,2] These 3D porous materials retain many of the unique properties of its constituent 2D material while creating a bulk, low density, flexible and ultralight version of its “bulk” form. For example, 3D-graphene (3D-C), has combined the advantages of high specific surface area, strong mechanical strength with excellent transport kinetic (both thermal[3,4] and electrical[1] and has widen its application horizon into stretchable electronics,[1,5] energy storage,[6] chemical and mechanical sensing[7] and electromagnetic interference (EMI) shielding.[8] Not long ago, h-BN, the isoelectric analogs to graphene with similar structural properties except for its electrical insulation with high dielectric constant,[9] has also evolved into the 3D form and found its niche in ultralow permittivity applications. This ceramic bulk foams are also found to have high specific strength, low dielectric constants and loss tangents, and good thermal conductivity for high temperature application and thermal insulation.[2,10] More importantly, the crystalline structure of these two 3D materials (3D-C and 3D h-BN) closely matches with one another, leading to remarkably similar material properties (very high thermal conductivity, high temperature stability, excellent mechanical properties) and also contrasting (electrical conductivity, permittivity) at the same time.[11–13] Furthermore, due to the close lattice matching (
